Modeling of elements and nodes of res. Modeling of elements and assemblies of electronic distribution systems: Program of the academic discipline and guidelines for completing the test

DEPARTMENT OF RADIO ELECTRONICS

Acoustic relay on field effect transistor

Explanatory note

for course work in the discipline:

FKRE 467.740.001.PZ

Completed Art. gr. 220541 Galkin Y.A.

Head Ovchinnikov A.V.

Federal Agency for Education

Tula State University

Department of Radio Electronics

for course work on the course

“Fundamentals of computer design and modeling of electronic distribution systems”

student gr. 220541 Galkin Y.A.

1. Topic: Acoustic relay on a field-effect transistor

2. Initial data: Electrical circuit diagram.The device is intended for indoor use at operating air temperatures of +10 0+ 40 0 ± 5 0 C, atmospheric pressure 86.6-106.7 kPa and the upper value of relative humidity 80% at a temperature of 25 0 C.MTBF - 30 years. Reliability after 5000 operating hours should be greater than 0.8.

3. List of issues that require elaboration Develop a printed circuit board for this device, select board and case materials, calculate the design parameters of the board, calculate manufacturability, and calculate reliability.

4. List of graphic material: Electrical circuit diagram, printed circuit board.

5. Main bibliography: Akimov I.N. “Resistors, Capacitors. Directory", Romanycheva E.T. and others. Development and execution of design documentation for REA: reference book, Design and production of printed circuit boards: Textbook. allowance/ L.P. Semenov.

Accepted the task Galkin Ya. A.

(signature) (full name)

Issued the task Ovchinnikov A.V.

(signature) (full name)

annotation

In this course project, I analyze the technical specifications, on its basis I select a method for manufacturing a printed circuit board, calculate the design and technological parameters of a printed circuit board, select elements and materials, as well as calculate reliability.

In addition to the calculation part, the course project develops a technological process for manufacturing a printed circuit board and fills out operational cards for the manufacturing process of a printed circuit board.

All documentation must comply with ESKD standards.

The explanatory note contains 25 sheets.

Electrical circuit diagram of an acoustic relay on a field-effect transistor (A3 format);

List of elements (A4 format).

Introduction……………………………………………………………………………….6

Analysis terms of reference……………………………………....7
Selection and justification of the elements and materials used…..9
Selection and justification of design solutions………………..10
Selection and justification of the method of manufacturing a printed circuit board....11
Description of the device design………………………………..12
Calculation of design manufacturability………………………..….15
Calculation of design parameters of a printed circuit board……….….18
Reliability calculation………………………………………….….20
Conclusion…………………………………………………….….23

List of references……………………………….….24

Introduction

Design documentation (CD) is a set of design documents containing, depending on their purpose, the data necessary for the development, manufacture, control, acceptance, delivery, operation and repair of a product. The design documentation contains not only drawings, but also describes methods for creating individual parts, as well as assembling assemblies.

The main task of design is the selection of optimal solutions for certain requirements specified in the technical specifications (specifications). Such requirements may be: price, reliability, prevalence (of materials and (or) elements), etc.

The design of radio-electronic equipment (REA) differs from others in the peculiarity of the internal connections formed between parts: in addition to spatial and mechanical ones, complex electrical, thermal and electromagnetic connections must be established. This feature is so significant that it separates the design of electronic equipment into a separate engineering direction.

Analysis of technical specifications

In this course work it is required to develop an acoustic relay based on a field-effect transistor. To assemble the electronic part of the device, a single-sided printed circuit board is used, which is fixed in a plastic case.

This relay has the following parameters:

The body of the device should be comfortable to hold in your hands, and the controls should be located so that it is not difficult for the operator to control the model.

The device must operate reliably under the following conditions:

This device circuit uses a microphone, as well as its amplifier based on transistor VT1 to open the relay, the amplification power is regulated using trimming resistor R6. The relay can also be opened by pressing the S1 button once.

The opening is carried out using the charge accumulated on capacitor C5. After opening, this capacitor, as well as capacitor C9 (it regulates the opening time of the relay) are discharged through resistors R10, R11. Transistor VT4 is also used to speed up discharge.

When the relay opens (transistor VT5 opens), the current in circuit R12, HL1 stops, the microphone amplifier is de-energized, and the voltage on capacitor C4 drops to 0.

The relay closes after the VT5 transistor closes. After closing, the power to the LED and microphone amplifier is restored - the device returns to its original state.

All elements are quite reliable in use, inexpensive and meet all operational and electrical requirements, and also have acceptable dimensions.

Selection and justification of elements and materials.

2.1 Selection of resistors.

To manufacture the device, we will select the MLT type resistors, the most common in industrial production, with a rated dissipation power of 0.125 W, these resistors are designed to operate at an ambient temperature of -60 h +70°C and relative humidity up to 98% at a temperature of +35°C, which satisfies the technical specifications. Some resistors, according to technical specifications, require more power; in accordance with the requirements, we select more powerful ones.

We choose the tuning resistor type SP3 - 19.

Also, to save space, I used resistors K1-12 - open-frame.

The nominal resistance of all resistors is indicated in the list of elements. They correspond to the standard range of resistances that are recommended for this type of resistor.

2.2 Selection of capacitors.

We choose electrolytic capacitors of the K50 type, since they are quite cheap and common. If possible, to reduce the size, we choose open-frame capacitors of the K10 type. High voltage capacitors are also required, we select capacitors that satisfy this condition - K73. We chose them based on the fact that they are suitable for the rated voltage and have a relatively small size, and they are also suitable for the operating temperature range. Electrolytic capacitors are oxide-electrolytic capacitors designed for operation in direct and pulsed current circuits with ambient temperatures of -20h +70°C and have a minimum operating time of 5000 hours, designed for mounting on a printed circuit board.

2.3 LED selection.

The red LED HL1 AL307 is used as an indicator of the operation of the device, as it is the cheapest, simplest and most reliable.

2.4 Selection of housing material.

We will choose a molded plastic case as the lightest, providing sufficient structural strength and small dimensions in accordance with the technical specifications.

2.6 Selecting a power system.

This device is powered from a network ~220V, 50 Hz, through the load.

2.7 Selecting printed circuit board material.

This device uses a printed circuit board made of fiberglass. This material was taken as it is often used in production. It is mechanically stronger, and also has weakened capacitive connections compared to other materials (for example, getinax).

3. Selection and justification of the design solution.

Printed wiring is widely used in the design of electronic power distribution systems. It is made in the form of printed circuit boards or flexible printed cables. A dielectric or dielectric-coated metal is used as the substrate for a printed circuit board, and a dielectric is used for flexible printed cables. To make printed conductors, the dielectric is often covered with copper foil with a thickness of 35...50 µm, or copper or nickel foil with a thickness of 5...1 0 µm. We are not able to use a single-sided printed circuit board; due to the complexity of the device, we use a double-sided one. Printed installation is performed using the basic combined positive method (with pre-drilling holes). This method based on the processes of galvanic copper deposition.

When determining the board area, dimensions and aspect ratio, the following factors were taken into account: the area of the elements placed on the board and the area of auxiliary zones; acceptable dimensions in terms of technological capabilities and operating conditions. When determining the area of the board, the total area of the elements installed on it is multiplied by a disintegration coefficient equal to 1.5...3, and the area of auxiliary zones is added to this area. Disintegration is carried out in order to provide clearances for placing communication lines and heat removal. Excessive reduction of the gaps between elements on the board can lead to an increase in thermal stress.

Together with the other parts, the board is placed in the case with mounting screws.

Since the specific power dissipation is low, natural cooling is used.

4. Selection and justification of the printed circuit board manufacturing method.

Depending on the number of applied conductive layers, printed circuit boards (PCBs) are divided into single-sided, double-sided and multilayer. Double-sided PPs are made on a relief cast base without metallization or with metallization. They are used for installation of household radio equipment, power supplies and communication equipment.

Methods for manufacturing PP are divided into two groups: subtractive and additive, as well as combined (mixed). In subtractive methods, foil dielectrics are used as a base for printed wiring, on which a conductive pattern is formed by removing foil from non-conducting areas. Additive methods are based on the selective deposition of a conductive coating, onto which a layer of an adhesive composition can first be applied.

Despite the advantages, the use of the additive method in the mass production of PP is limited by the low productivity of the chemical metallization process, the intense effect of electrolytes on the dielectric, and the difficulty of obtaining metal coatings with good adhesion. Subtractive technology is dominant in these conditions, but the most advantageous (since it takes advantages from both methods) is combined.

The main methods used in industry to create a printed circuit design are offset printing, grid printing and photo printing. The choice of method is determined by the design of the PCB, the required accuracy and installation density, equipment performance and process efficiency.

Since the PCB is double-sided, the installation density is not high (the minimum width of the conductors is not less than 1 mm) and the production is definitely serial, in this course work the board is manufactured using a mesh-chemical method. This method is widely used in mass and serial production of printed circuit boards made of fiberglass. As a rule, the production of circuit boards is carried out on universal mechanized lines, consisting of individual automatic and semi-automatic machines that consistently perform technological process operations.

The entire process of manufacturing printed circuit boards consists of the following main technological operations:

1. Cutting material and making blank boards;

2. Drawing the diagram with acid-resistant paint;

3. Etching;

4. Removing the protective layer of paint;

5. Kratsovka;

6. Application of a protective epoxy mask;

7. Hot tinning of soldering points;

8. Stamping;

9. Marking;

10. Board control.

In order to maximize mechanization and automation of the process, all printed circuit boards are manufactured (processed on line) on one of the dimensional technological blanks.

The technological process is described in more detail in the Appendix.

5. Description of the device design.

The device is made in accordance with the technical specifications, placed in a housing made of plastic. Case dimensions 1359545. All radio elements are placed on a printed circuit board located horizontally. The board is attached to the case using a screw connection. The housing cover is attached to the housing with two screws.

A groove is cut out on the side of the case for the outlet of the network cable. There is a hole drilled in the top of the case for installation. LED indicator, there is also a slot that facilitates the access of sound waves to the speaker located inside the device. To reduce the cost of execution, I chose a red LED.

6. Calculation of design manufacturability.

In practice, due to the fact that manufacturability is one of the the most important characteristics, there is a need to evaluate it when choosing the best option its manufacture from several possible ones.

There are many different indicators on the basis of which both the overall and its individual components are assessed. Let's look at some of them.

6.1 Distribution of parts by succession

Based on Table 1, the following coefficients are determined:

Indicators
	Specially manufactured		Normal		Purchased
	For this	Borrowed bathrooms from other products,	fastenings,	Fasteners,	Non-standard	Standard
quantity names, D
quantity parts, W

Nsh.n.— number of non-fastening parts;

Nsh.p.s.— number of standard parts;

Nsh.k.— number of fasteners;

Nsh.v.- the number of all parts.

Nsh.z.— the number of parts borrowed from other products;

Nsh.k.- number of fasteners.

Nsh.s.— the number of parts manufactured specifically for this product;

Nd.s.- the number of varieties of parts manufactured specifically for this product.

Nsh.p.— number of non-standard parts.

Normalization factor

2. Borrowing ratio:

3. Repeatability factor:

4. Continuity rate:

6.2 Distribution of nodes by complexity and interchangeability within a node

Here, based on Table 2, the following coefficients are determined:

1. Assembly complexity factor:

2. Interchangeability coefficient within nodes:

7 . Calculation of design parameters of a printed circuit board.

As initial data, you must have: the design of the printed circuit board, the method of obtaining the pattern, the minimum distance between the holes, the pitch of the coordinate grid, the shape of the contact pads, the mounting density. As a result, the diameter of the contact pad, the width of the conductor, and the distance between the conductive elements are calculated.

The board is manufactured using the mesh-chemical method according to the second class of accuracy. Its main design parameters are as follows:

Minimum value of the nominal conductor width t H =1 mm;

Nominal distance between conductors S H =0.5 mm;

Ratio of hole diameter to board thickness ≥ 0.33;

Hole tolerance ∆d=±0.05 mm;

Conductor width tolerance mm;

Tolerance for hole location mm;

Tolerance for the location of contact pads mm;

Tolerance for the location of conductors mm;

The conductor width value is determined by the formula:

where is the lower limit deviation of the conductor width. In this case t=1.05 mm.

The diameter of the mounting holes is calculated as follows:

where is the diameter of the outlet of the installed element; - lower limit deviation from the nominal diameter of the mounting hole; - difference between minimum hole diameter and

maximum diameter of the installed outlet.

Then d 1 =0.5 mm, d 2 =0.8 mm, d 3 =1 mm, d 2 =1.1 mm.

Let's determine the diameter of the contact pads:

where is the upper limit deviation of the hole diameter; - upper limit deviation of the conductor width.

Then D 1 =1.8 mm, D 2 =2 mm, D 3 =2.2 mm, D 2 =2.3 mm.

Let's find the value of the minimum distance between adjacent elements of the conductive pattern:

Substituting the value we get that

The calculated parameters correspond to the printed circuit board drawing. The chosen method of manufacturing a printed circuit board allows you to produce a board with the obtained parameters.

8. Calculation of reliability.

Reliability calculation consists of determining quantitative indicators of system reliability based on the values of the reliability characteristics of the elements.

Depending on the completeness of taking into account the factors affecting the reliability of the system, an approximate reliability calculation, an approximate calculation and an updated calculation can be carried out.

Approximate calculations are carried out at the design stage, when there are no schematic diagrams of the system blocks yet. The number of elements in blocks is determined by comparing the designed system with similar, previously developed systems.

Reliability calculations when selecting types of elements are carried out after the development of fundamental electrical diagrams. The purpose of the calculation is to determine the rational composition of the elements.

Reliability calculations when clarifying the operating modes of elements are carried out when the main design problems have been solved, but the operating modes of the elements can still be changed.

The results of the approximate reliability calculation are presented in the form of a table.

Name and type of elements	Designation	Failure rate
Diode bridge
Pulse alloy diodes
Double button
Packless capacitors
Ceramic capacitors
Film capacitors
Electrolytic capacitors
Microphone

Connecting wires
Resistors MLT-0.25	R2, R3, R10, R13-R15, R17
Resistors MLT-1.0
Resistors, unpackaged	R1, R4, R5, R7-R9,R11, R12, R16, R18
Trimmer resistor
Light-emitting diode
Zener diode
Field effect transistors
Bipolar transistors
Connector PC4TV plug

The average time between failures is:

The reliability graph is constructed according to the exponential law

This graph is shown in Fig. 1.

Fig.1. Device reliability chart.

These results satisfy the TK condition.

9. Conclusion.

When performing coursework on the topic “Acoustic relay on a field-effect transistor,” calculations were made of the design and technological parameters of the printed circuit board and the reliability of the circuit. The choice and justification of the method of manufacturing the printed circuit board and elements was made.

As a result of the work, a device was developed that fully complies with the technical specifications.

Based on the calculation results, we can conclude that the device can be produced both serially and individually without any restrictions.

List of used literature.

1. Brief reference book for the designer of radio-electronic equipment. Ed. R. G. Varlamova. M., “Sov. radio", 1973, 856 p.

2. Pavlovsky V.V., Vasilyev V.P., Gutman T.N., Design of technological processes for manufacturing REA. Guide to course design: Proc. manual for universities. - M.: Radio and communication, 1982.-160 p.

3. Development and execution of design documentation for radio-electronic equipment: Directory / E.T. Romanycheva, A.K. Ivanova, A.S. Kulikov and others; edited by THIS. Romanycheva. -2nd ed., revised. and additional - M.: Radio and Communications, 1989. - 448 p.

4. Collection of tasks and exercises on REA technology: C32 Textbook/ Ed. E. M. Parfenova. - M.: Higher. school, 1982. - 255 p.

5. Resistors: (reference book) / Yu. N. Andreev, A. I. Antonyan, etc.; Ed. I.I. Chetvertakova. - M.: Energoizdat, 1981. - 352 p.

6. Collection of problems on reliability theory. Ed. A. M. Polovko and I. M. Malikova. M., Publishing house "Soviet Radio", 1972, 408 pp.

7. Technology and automation of radio-electronic equipment production: Textbook for universities / I.P. Bushminsky, O.Sh. Dautov, A.P. Dostanko and others; Ed. A.P. Dostanko, Sh.M. Chabdarova. - M.: Radio and Communications, 1989. - 624 p.

8. Integrated circuits: Directory / B.V. Tarabrin, L.F. Lunin and others; Ed. B.V. Tarabrina. - M.: Radio and communications. 1984 - 528 p.

set graph algorithm iterative

The tasks of placing elements and routing their connections are closely related and are solved simultaneously with conventional, “manual” design methods. In the process of placing elements, connection routes are refined, after which the position of some elements can be adjusted. Depending on the adopted design, technological and circuitry base, various criteria and restrictions are used when solving these problems. However, all specific varieties of the mentioned problems are associated with the problem of optimizing connection diagrams. The result is an exact spatial arrangement of the individual elements of a structural unit and a geometrically defined method of connecting the terminals of these elements.

Quality criteria and limitations associated with specific placement and routing tasks are based on specific design and technological features of the implementation of the switching part of the node. The entire set of criteria and restrictions can be divided into two groups in accordance with the metric and topological parameters of the design of nodes and circuits.

Metric parameters include the dimensions of elements and the distances between them, the dimensions of the switching field, the distances between the terminals of the elements, permissible connection lengths, etc.

Topological parameters are mainly determined by the method adopted in a particular design for eliminating intersections of connections and the relative location of connections on the switching field. These include: the number of spatial intersections of connections, the number of interlayer transitions, the proximity of fuel elements or electromagnetically incompatible elements and connections to each other.

In specific problems, these parameters in various combinations can be either the main optimization criteria or act as constraints.

In this regard, in an algorithmic approach to solving them, they are usually considered separately. First, the elements are placed, and then the interconnects are routed. If necessary, this process can be repeated with a different arrangement of individual elements.

The main purpose of placement is to create the best conditions for subsequent routing of connections while meeting the basic requirements that ensure the operability of the circuits.

The criterion in most cases is the criterion of minimum weighted length (MSL) of connections, which integrally takes into account the numerous requirements for the arrangement of elements and routes of their connections. This is due to a number of factors:

Reducing connection lengths improves the electrical parameters of the circuit;

The shorter the total length of the connections, the simpler, on average, is their implementation during the routing process;

Reducing the total length of connections reduces the complexity of manufacturing wiring diagrams, especially wiring diagrams;

This criterion is relatively simple from a mathematical point of view and allows you to indirectly take into account other parameters of the circuits by assigning weights to individual connections.

be able to:

Perform a quantitative assessment of the quality level of RES designs using single and complex indicators;

Apply probabilistic and statistical methods for analysis accuracy and stability of parameters of RES designs;

Calculate reliability indicators of designed RES and implement methods to improve reliability of devices at the stages of design, production and operation;

Apply methods forecasting for prediction functional parameters and reliability of elements and devices;

Fulfill using a computer, statistical modeling of design parameters of electronic power stations, queuing systems, reliability of elements and devices.

Physical basis for the design of radio-electronic equipment

know:

Characteristics of the impacts to which RES are exposed during operation;

Physical phenomena occurring in RES structures under the influence of thermal and mechanical loads, electromagnetic interference and other factors;

Methods for protecting RES from action destabilizing factors;

be able to:

Choose design methods to ensure protection of RES from destabilizing factors;

- simulate the impact of destabilizing factors on the design of electronic distribution systems;

Perform calculations to assess the effectiveness of protection of the RES structure from destabilizing factors.

Element base of radio-electronic equipment

Classification, general characteristics and evolution of the RES element base. Capacitors, resistors, inductors and transformers (designs, parameters, accuracy and stability characteristics). Active and passive leadless components. Basic designs and main characteristics of electronic components. Switching devices and connectors. Principles of construction and operation of filters, delay lines and resonators on surface acoustic waves. Principles of construction and operation of charge-coupled devices in signal processing devices and image receivers. Classification and basic properties of memory devices. Memory elements on magnetic domains. Semiconductor large integrated circuits (LSI) storage devices. Elements of optoelectronic information processing systems. Liquid crystal indicators. Cryotrons and devices based on the Josephson effect. Chemotrons and other functional electronics devices.

As a result of studying the discipline, the student must:

know:

- operating principles and physical effects used in RES elements;

- basic properties, characteristics and design and technological features of the element base of the electronic distribution system;

be able to:

- analyze work various types elements and determine the possibility of their functional use in RES designs;

- it is reasonable to choose the types of elements depending on the purpose and operating conditions of the RES.

Electronic technology and modeling of technological systems

Features of the object and principles of constructing RES production processes. Technological systems in the production of electronic devices. Technological accuracy and reliability of technological systems and processes. Production and technological processes, their structure and elements. Selection of the optimal technological process option using technical and economic indicators. Technologies of printed circuit boards, multilayer and switching boards. Electrical installation and mechanical connection technology. Winding technology and equipment. Assembly and installation of functional cells, blocks and microblocks. Surface mounting. Sealing, monitoring, diagnostics and adjustment of RES parameters. Scientific foundations of complex automation; automated technological equipment; design of automatic lines. Structure and technical support for managing flexible production systems; structure of an automated system for technological preparation of production, functions of subsystems; automated design of technological processes and special equipment. Computer design of technological processes for manufacturing electronic devices. Integrated computer production of RES. Statistical modeling of technological systems and processes. Operation of technological systems.

As a result of studying the discipline, the student must:

know:

Physico - technological basics technological assembly and installation processes, control, adjustments in the production of RES;

Application packages of computer-aided design programs, modeling and optimization of technological processes and production systems;

Principles of organizing, building and managing flexible technological systems and integrated production of distribution networks;

be able to:

Design technological processes and systems automated production using application programs;

Model and optimize technological processes automated production of electronic devices using industrial robots and microprocessor systems;

Perform accuracy and tune assessments technological processes of integrated production of RES and ensure technological reliability and quality of manufactured products;

Develop technological documentation

Design and computer-aided design of integrated circuits

As a result of studying the discipline, the student must:

know:

Materials used for the production of ICs;

Contents of the main technological operations of IC production;

Element designs semiconductor and hybrid ICs;

Mathematical models and equivalent circuits of IC elements for various operating modes;

Software automated IC design ( technological, elemental, topological and circuitry);

be able to:

Perform element calculations semiconductor and hybrid ICs;

Develop topology and design installation and assembly operations of hybrid ICs;

Determine parameters of mathematical models elements and use these parameters in computer-aided design tasks of ICs;

Apply software automated design for IC development.

Design of radio-electronic devices

Classification of RES designs depending on the place of use and operating conditions, functional purpose, principle of signal processing and other factors. Methodology for designing RES. Stages of development of RES. Characteristics of the main stages of the design of the RES (analysis of technical requirements and electrical circuits, development of technical specifications for the design of the RES, selection of the design layout of the structure, selection of the element base and materials, load-bearing structures). Assessment of the quality and reliability of the RES design. Characteristics of electrical installation methods used in RES designs. Electrical installation. Design of printed wiring and functional units based on it. Solving problems of placing elements and routing connections, using computer-aided design packages. Layout of functional units, blocks, devices, devices and systems. Layout based on unified load-bearing structures. Quantitative assessment of layout quality. Ensuring protection of the distribution network from the action of destabilizing factors. Modeling the influence of destabilizing factors and quantitative assessment of the effectiveness of the protection methods used. Ensuring compatibility of the RES design with the operator: design of front panels, artistic design. Design design of RES for various functional purposes, different categories (ground, airborne, sea) and types (stationary, mobile, portable, etc.). Features of the design of ultra-high frequency (microwave) devices. Design documents and their classification. Rules for executing diagrams, drawings of parts, drawing up specifications and developing assembly drawings for devices (assembly units), developing and executing other design documents.

As a result of studying the discipline, the student must:

know:

Main stages design design of RES (methodology design);

Types of layout and basic layout diagrams functional units, blocks, devices, devices and systems; printed circuit design methods;

Principles of external design of RES structures, including design issues;

Peculiarities design designing RES for various purposes;

Basic rules for the development of design documentation for radio electronics products;

be able to:

Select layout diagrams of the designed functional units, blocks, devices, devices, systems and carry out intra-unit and external layout of electronic distribution systems;

Design printed circuit boards and functional units based on them;

Ensure compatibility of RES designs and their parts with the external environment, the installation object and the operator;

Evaluate quality designed RES designs;

Design design documentation

Microprocessor systems in radio-electronic devices

Subject, purpose and content of the course. Basic definitions and principles of organization of microprocessor systems (MPS). Operating modes of the MPS. MPS architecture. Types of MPS. MPS tires. Cycles in the MPS. Functions of bus devices (processor, memory, input/output devices). Classification and structure of microcontrollers (MC). MK processor core. MK synchronization circuit. Memory of programs and data of the MK. MK registers. Stack and external memory MK. I/O ports. Timers and event processors. Additional MK modules. MK hardware. Features of architecture. Organization of program memory and stack. Organization of data memory. Types of addressing. I/O ports. Timer module and timer register. Data memory in EEPROM. Organization of interruptions. Special functions and MK command system. Features of the development of digital devices based on MPS. Features of various types of processors. Devices included in a personal computer. System data exchange backbone. Additional personal computer interfaces. Command systems of microprocessors and MKs of various types. The use of microprocessors and microcontrollers in the designs of electronic devices for various functional purposes.

As a result of studying the discipline, the student must:

know :

- fundamental principles of microprocessor technology, basic terminology, architectural features of MPS and their main types, as well as principles of organizing information exchange in MPS;

- basic principles functioning processor, its capabilities and structural elements, instruction system and addressing methods;

- organization of MK and personal computers.

be able to:

- design MPS hardware and software;

- apply MPS in the designs of RES for various functional purposes.

Computer-aided design systems for radio-electronic equipment

Purpose and scope of application of computer-aided design systems for radio-electronic equipment (CAD) of electronic distribution systems. Design of printed circuit boards using CAD: library elements in the design of electrical circuits and printed circuit boards; electrical circuit design; placement of components on a printed circuit board; auto-routing of conductors, checking the topology of printed circuit boards; preparation of production of printed circuit boards; analysis of signal integrity taking into account the geometry of printed conductors; data exchange with other CAD systems; design of multilayer printed circuit boards. Organization of graphic data; planar drawing; graphic drawing primitives; editing drawing objects; design of drawings: shading, dimensions; spatial modeling of structures; surface and solid design of objects; image of three-dimensional objects; use of CAD programming systems; organization of dialogue in CAD and user interface standards. Parametric capabilities of modern CAD systems; dimensional and geometric restrictions on model parameters; designing models of parts and assemblies; obtaining drawings of parts and assemblies based on models. Analysis, verification and optimization of design solutions using CAD tools; modeling of assembly processes, manufacturing of parts, behavior of structures under influencing factors. Data exchange formats in CAD.

As a result of studying the discipline, the student must:

know:

- characteristics modern systems computer-aided design of radio-electronic equipment;

- methodology for designing electrical circuits and printed circuit boards using computer-aided design systems for radio-electronic equipment;

- algorithms for placement and routing of printed circuit boards used in modern CAD systems;

- structural design methods using two-dimensional and spatial design;

be able to:

- design electrical circuits and printed circuit boards using CAD;

The textbook was developed for students of the Faculty of MRM of SibGUTI studying the discipline “Fundamentals of computer design and modeling of RES”

Introduction 8

Chapter 1. Basic concepts, definitions, classification 9

1.1 Concepts of system, model and simulation 9

1.2 Classification of radio devices 10

1.3 Main types of problems in radio engineering 12

1.4 Development of the concept of model 14

1.4.2 Modeling is the most important stage of purposeful activity 15

1.4.3 Cognitive and pragmatic models 15

1.4.4 Static and dynamic models 16

1.5 Methods for implementing models 17

1.5.1 Abstract models and the role of languages 17

1.5.2 Material models and types of similarity 17

1.5.3 Conditions for implementing the properties of models 18

1.6 Correspondence between model and reality in terms of difference 19

1.6.1 Finiteness of models 19

1.6.2 Simplification of models 19

1.6.3 Approximation of models 20

1.7 Correspondence between model and reality in the aspect of similarity 21

1.7.1 Model truth 21

1.7.2 About the combination of true and false in model 21

1.7.3 Complexities of modeling algorithms 22

1.8 Main types of models 23

1.8.1 The concept of a problem situation when creating a system 23

1.8.2 Main types of formal models 24

1.8.3 Mathematical representation of the black box model 28

1.9 Relationships between modeling and design 32

1.10 Simulation accuracy 33

Chapter 2. Classification of modeling methods 37

2.1 Real simulation 37

2.2 Mental simulation 38

Chapter 3. MATHEMATICAL MODELING 40

3.1 Stages of creating mathematical models 43

H.2 Component and topological equations of the modeled object 46

3.3 Component and topological equations of an electrical circuit 46

Chapter 4. Features computer models 50

4.1 Computer modeling and computational experiment 51

4.2 Computer modeling software 52

Chapter 5. FEATURES OF THE RADIO SYSTEM AS AN OBJECT OF STUDY USING COMPUTER SIMULATION METHODS 57

5.1 Classes of radio systems 57

5.2 Formal description of radio systems 58

Chapter 6. USING THE MATHCAD APPLICATION PACKAGE FOR SIMULATING TELECOMMUNICATION DEVICES 64

6.1 Basic information about the universal mathematical software package MathCAD 64

6.2 Basics of the MathCAD 65 language

6.2.1 Input language typeMathCAD 66

6.2.2 Description of the MathCAD 67 text window

6.2.3 Input cursor 68

6.2.5 Managing interface elements 70

6.2.6 Selecting areas 71

6.2.7 Changing the document scale 71

6.2.8 Screen update 72

6.3 Basic rules for working in the MathCAD environment 79

6.3.1 Deleting mathematical expressions 79

6.3.2 Copying mathematical expressions 80

6.3.3 Transferring mathematical expressions 80

6.3.4 Entering text comments into the program 80

6.4 Plotting graphs 81

6.4.1 Plotting graphs in a Cartesian coordinate system 81

6.4.2 Plotting graphs in the polar coordinate system 83

6.4.3 Changing the graph format 85

6.4.4 Graph Tracing Rules 85

6.4.5 Rules for viewing sections of two-dimensional graphs 86

6.5 Rules for calculations in the MathCAD environment 87

6.6 Analysis of linear devices 93

6.6.1 Transfer function, transmission coefficient, time and frequency characteristics 94

6.6.2 Transfer coefficient K(jω) 95

6.6.3 Amplitude-frequency response (AFC) 96

6.6.4 Determination of transient and impulse characteristics 98

6.7 Methods for solving algebraic and transcendental equations in the MathCAD environment and organizing calculations in a cycle 101

6.7.1 Determining the roots of algebraic equations 101

6.7.2 Determining the roots of transcendental equations 103

6.7.3 Cycle calculations 106

6.8 Data processing 108

6.8.1 Piecewise linear interpolation 108

6.8.2 Spline interpolation 110

6.8.3 Extrapolation 112

6.9 Symbolic calculations 115

6.10 Optimization in REA calculations 124

6.10.1 One-dimensional optimization strategies 124

6.10.2 Local and global extremes 126

6.10.3 Methods for including uncertainty intervals 127

6.10.4 Optimization criteria 135

6.10.6 Example of writing an objective function when synthesizing filters 141

6.11 Animation of graphic material in the MathCAD environment 148

6.11.1 Preparing for animation 149

6.11.2 Example of chart animation 149

6.11.3 Calling the animation player for graphs and video files 151

6.12 Establishing a connection between MathCAD and other software environments 153

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Voronezh Institute of the Ministry of Internal Affairs of Russia

Department of private security

TEST

in the discipline "Fundamentals of computer design and modeling of radio-electronic equipment"

Topic: “Circuit modeling of radio-electronic equipment”

Developed by: cadet of the 41st training platoon, private police officer R.G. Vostrikov

Voronezh 2015

Introduction

1. Introduction to CAD

2.3 Simulation of dynamic characteristics

2.4 Frequency response modeling

Conclusion

Bibliography

Introduction

A computer-aided design system (CAD) is an organizational and technical system consisting of a set of design automation tools and a team of specialists from departments of a design organization that performs computer-aided design of an object, which is the result of the activities of the design organization.

The use of computer-aided design (CAD) systems allows us to move from traditional prototyping of the equipment being developed to its modeling using a computer. In this case, as a rule, an end-to-end design cycle is carried out, which includes:

Synthesis of the structure and circuit diagram of a radio-electronic device (RES);

Analysis of its characteristics in various modes, taking into account the spread of component parameters and the presence of destabilizing factors, carrying out parametric optimization;

Topology synthesis, including placement of elements on a printed circuit board and layout of interconnections;

Verification (check) of the printed circuit board topology;

Release of design documentation.

Problems of structural synthesis are solved using highly specialized programs focused on devices of a certain type, created, for example, a large number of programs for the synthesis of matching circuits, analog and digital filters. The greatest achievements in constructing programs for structural synthesis and synthesis of circuit diagrams are in the field of designing digital devices. The structure and circuit diagram of most devices largely depend on the field of application and the initial design data, which creates great difficulties in synthesizing a circuit diagram using a computer. Therefore, usually the initial version of the circuit is compiled by an engineer “manually”, followed by modeling and optimization on a computer.

Modern CAD programs work in interactive mode and have a large set of service modules. CAD software packages are capable of solving the most complex problems of modeling electronic devices, such as power supplies, amplifiers, signal converters and others. The results of the simulation are DC modes, signal oscillograms, frequency and spectral characteristics, and even element temperatures. In terms of their capabilities, simulation programs can even surpass measuring instruments; for example, they allow you to observe oscillograms of currents and powers in elements without adding measuring resistors to the device. The results obtained can help identify the causes of possible or real malfunctions in the device and find ways to improve its quality. The use of simulation programs allows you to analyze a large number of different circuit design options and select the best one from them, without spending a single radio element on it.

The PCB topology is developed after the circuit modeling is completed. At this design stage, elements are placed on the printed circuit board and connections are routed. The most successfully developed printed circuit boards for digital devices are those where human intervention in the process of topology synthesis is relatively small. The development of analog devices requires much more human participation in the design process, correction and, if necessary, partial reworking of computer-aided design results. The main difficulty in developing analog equipment is automating topology synthesis and ensuring the interaction of circuit modeling and topology synthesis programs. In addition, it is quite difficult to formalize numerous additional requirements for analog devices, for example, the requirement for electromagnetic compatibility of components.

The main goal of the test is to master the methodology of computer-aided design and circuit modeling of components and blocks of electronic distribution systems using CAD tools.

The following tasks serve to achieve this goal:

1) studying the capabilities of modern CAD RES application packages;

2) the formation of theoretical knowledge and practical skills in using CAD tools in the circuit modeling of components and blocks of electronic distribution systems.

During the test, the following is required:

1) analyze the main capabilities of the circuit modeling package used in the test work;

2) perform modeling of static, dynamic and frequency characteristics of RES nodes and blocks;

3) optimize the parameters and characteristics of the RES.

1. Introduction to CAD

Design automation occupies a special place among information technologies. Firstly, design automation is a synthetic discipline; its components are many other modern information Technology. Thus, the technical support of computer-aided design (CAD) systems is based on the use of computer networks and telecommunication technologies; CAD uses personal computers and workstations.

CAD software is distinguished by the richness and variety of methods used in computational mathematics, statistics, mathematical programming, discrete mathematics, and artificial intelligence. Secondly, knowledge of the basics of design automation and the ability to work with CAD tools is required by almost any development engineer. Design departments, design bureaus and offices are full of computers. The work of a designer at an ordinary drawing board, calculations using a slide rule or drawing up a report on a typewriter have become an anachronism. Enterprises that develop without CAD or with only a small degree of their use turn out to be uncompetitive, both because of the large material and time costs of design, and because of the low quality of projects. The appearance of the first programs for design automation abroad and in the USSR dates back to the early 60s. Then programs were created to solve problems in structural mechanics, analyze electronic circuits, and design printed circuit boards.

Further development of CAD followed the path of creating hardware and software for computer graphics, increasing the computational efficiency of modeling and analysis programs, expanding the areas of application of CAD, simplifying the user interface, and introducing elements of artificial intelligence into CAD.

To date, a large number of software and methodological complexes for CAD have been created with varying degrees of specialization and application orientation. As a result, design automation has become necessary integral part training of engineers of various specialties; an engineer who does not have knowledge and cannot work in CAD cannot be considered a full-fledged specialist.

The training of engineers of various specialties in the field of CAD includes basic and special components. The most general provisions, models and methods of computer-aided design are included in the course program on the basics of CAD; a more detailed study of those methods and programs that are specific to specific specialties is provided in specialized disciplines.

1.1 Basic principles of CAD design

CAD development is a major scientific and technical problem, and its implementation requires significant capital investment. The accumulated experience allows us to highlight the following basic principles for constructing CAD systems.

1.CAD - man-machine system. All design systems created and created using a computer are automated; an important role in them is played by a person - an engineer who develops a design for a technical device.

At present, and at least in the coming years, the creation of automatic design systems is not expected, and nothing threatens the human monopoly when making key decisions in the design process. A person in CAD must solve, firstly, all problems that are not formalized, and secondly, tasks that a person solves on the basis of his heuristic abilities more effectively than a modern computer based on its computing capabilities. Close interaction between man and computer in the design process is one of the principles for constructing and operating CAD systems.

2.CAD is a hierarchical system that implements an integrated approach to automation of all levels of design. The hierarchy of design levels is reflected in the structure of custom CAD software in the form of a hierarchy of subsystems.

It should be especially emphasized the expediency of ensuring the integrated nature of CAD, since design automation at only one of the levels turns out to be much less effective than complete automation of all levels. Hierarchical construction applies not only to special software, but also to CAD hardware, divided into a central computing complex and automated designer workstations.

3.CAD - a set of information-coordinated subsystems. This very important principle should apply not only to connections between large subsystems, but also to connections between smaller parts of subsystems. Information consistency means that all or most possible sequences of design problems are served by informationally consistent programs. Two programs are informationally consistent if all the data that represents the object of processing in both programs is included in numerical arrays that do not require changes when moving from one program to another. Thus, information connections can manifest themselves in the fact that the results of solving one problem will be the initial data for another task. If the coordination of programs requires significant processing of the general array with the participation of a person who adds missing parameters, manually rearranges the array, or changes the numerical values of individual parameters, then the programs are not informationally consistent. Manual re-arrangement of the array leads to significant time delays, an increase in the number of errors and therefore reduces the demand for CAD services. Information inconsistency turns CAD into a set of autonomous programs, while due to the failure to take into account in subsystems many factors assessed in other subsystems, the quality of design solutions decreases.

4.CAD is an open and developing system. There are at least two good reasons why CAD should be a time-varying system. Firstly, the development of such a complex object as CAD takes a long time, and it is economically profitable to put parts of the system into operation as they are ready. The commissioned basic version of the system is further expanded. Secondly, the constant progress of technology, designed objects, computer technology and computational mathematics leads to the emergence of new, more advanced mathematical models and programs that should replace old, less successful analogues. Therefore, CAD must be open system, i.e., have the property of being easy to use new methods and tools.

5.CAD is a specialized system with maximum use of unified modules. The requirements for high efficiency and versatility are usually contradictory. In relation to CAD, this provision remains in force. High efficiency of CAD, expressed primarily by low time and material costs when solving design problems, is achieved through specialization of systems. Obviously, the number of different CAD systems is growing. To reduce the costs of developing many specialized CAD systems, it is advisable to build them based on the maximum use of standardized components. A necessary condition for unification is the search for common features and provisions in the modeling, analysis and synthesis of heterogeneous technical objects. Of course, a number of other principles can be formulated, which emphasizes the versatility and complexity of the CAD problem.

1.2 Systematic approach to design

The basic ideas and principles of designing complex systems are expressed in the systems approach. For a specialist in the field of systems engineering, they are obvious and natural, however, their compliance and implementation are often associated with certain difficulties due to design features. Like most educated adults who use their native language correctly without the use of grammar rules, engineers use a systems approach without resorting to systems analysis manuals. However, an intuitive approach without applying the rules of system analysis may not be sufficient to solve increasingly complex engineering problems.

The main general principle of the systems approach is to consider the parts of a phenomenon or complex system, taking into account their interaction. The systems approach reveals the structure of the system, its internal and external connections.

1.3 CAD structure

Like any complex system, CAD consists of subsystems. There are design and maintenance subsystems.

Design subsystems directly carry out design procedures. Examples of design subsystems include subsystems for geometric three-dimensional modeling of mechanical objects, production of design documentation, circuit analysis, and routing of connections in printed circuit boards.

Servicing subsystems ensure the functioning of design subsystems; their combination is often called system environment(or shell) CAD. Typical service subsystems are design data management subsystems, CASE (Computer Aided Software Engineering) software development and maintenance subsystems, and training subsystems for users to master technologies implemented in CAD.

1.4 Types of CAD software

The structuring of CAD in various aspects determines the emergence of types of CAD software. It is customary to distinguish seven types of CAD software:

· technical (TO), including various hardware (computers, peripherals, network switching equipment, communication lines, measuring instruments);

· mathematical (MO), which combines mathematical methods, models and algorithms to perform design;

software (software) provided computer programs CAD;

· information (IO), consisting of a database, DBMS, and also including other data that is used in the design; note that the entire set of data used in design is called the CAD information fund, the database together with the DBMS is called a data bank;

· linguistic (LO), expressed by the languages of communication between designers and computers, programming languages and languages for data exchange between technical CAD tools;

· methodological (MetO), including various design techniques; sometimes it also includes mathematical software;

· organizational (OO), represented by staffing tables, job descriptions and other documents that regulate the work of the project enterprise.

1.5 Types of CAD

CAD classification is carried out according to a number of criteria, for example, by application, intended purpose, scale (complexity of the tasks being solved), and the nature of the basic subsystem - the CAD core.

By application, the most representative and widely used are the following CAD groups:

· CAD for use in general engineering industries. They are often called mechanical CAD systems or MCAD (Mechanical CAD) systems;

· CAD for radio electronics: ECAD (Electronic CAD) or EDA (Electronic Design Automation) systems;

· CAD in the field of architecture and construction.

In addition, a large number of specialized CAD systems are known, either classified in these groups, or representing an independent branch of the classification. Examples of such systems are CAD systems for large-scale integrated circuits (LSI); Aircraft CAD; CAD of electrical machines, etc.

Electronics Workbench is the international market leader in developing the world's most widely used circuit design software. The company has more than 15 years of experience in automating the design of electronic devices and devices and was one of the pioneers of computer-aided electronics development. Currently, Electronics Workbench equipment is used in more than 180 thousand workplaces. The Electronics Workbench product suite includes tools for circuit description, circuit emulation (SPICE, VHDL, and patented co-simulation), as well as PCB design and automated routing. Users receive a truly unique product, the easiest to use tools in the industry, integrated into a single whole. The Support and Upgrade Utility (SUU) automatically checks for and installs the necessary updates over the network, ensuring you always have the best high level operation of your software. Electronics Workbench and National Instruments products provide the tightest integration between electronic CAD design, verification, and testing tools currently available.

Multicap 9 is the most intuitive and powerful diagramming tool available. The latest Multicap tools save you significant time, including modeless editing, easy connectivity, and a comprehensive database broken down into logical chunks right on your desktop. These tools allow you to programmatically describe a design almost immediately after you have a general idea of it. The same sequences of actions are performed automatically, without taking time away from creating, checking and improving the circuit, thanks to which the output is ideal products with minimal development time.

Figure 1 - Electronics Workbench Software Relationship

Multisim is the world's only interactive circuit emulator, allowing you to create better products in less time. Multisim includes a version of Multicap, making it ideal for programmatic description and immediate subsequent testing of circuits. Multisim 9 also supports interoperability with National Instruments' LabVIEW and SignalExpress for tight integration of development and test tools.

The benefits of integrated description and emulation Multisim is the unique ability to develop a circuit and test/emulate it from one development environment. There are many advantages to this approach. Beginners to Multisim do not need to worry about the complex SPICE (Simulation Program with Integrated Circuit Emphasis) syntax and commands, while advanced users have the ability to customize all SPICE parameters. Thanks to Multisim, circuit description has never been easier and more intuitive. The spreadsheet view allows you to simultaneously change the characteristics of any number of elements: from a printed circuit board diagram to a SPICE model. Modeless editing is the most effective method placement and connection of components.

Working with analog and digital components is intuitive and easy. In addition to traditional SPICE analysis, Multisim will allow users to connect virtual instruments to the circuit. The concept of virtual instruments is a simple and fast way to see the result by simulating real-life events. Multisim also has special components called interactive parts that you can change during emulation. Interactive elements include switches, potentiometers; the slightest changes in an element are immediately reflected in the simulation. When more complex analysis is required, Multisim offers over 15 different analysis functions. Some examples include using alternating current, Monte Carlo, worst case and Fourier analysis. Multisim includes Grapher, a powerful tool for viewing and analyzing emulation data. The circuit description and testing functions provided in Multisim will help any circuit designer, save him time and save him from errors throughout the circuit development process.

Micro-Cap is a universal circuit analysis program designed to solve a wide range of problems. A characteristic feature of this program, as well as the entire Micro-Cap family, is the presence of a convenient and user-friendly graphical interface, which makes it especially attractive to a non-professional audience. Despite the rather modest requirements for PC software and hardware (processor no lower than Pentium II, Windows 95/98/ME or Windows NT4/2000/XP, memory no less than 64 MB, monitor no worse than SVGA), its capabilities are quite large. With its help you can analyze not only analog, but also digital circuits. Mixed modeling of analog-digital electronic devices, as well as filter synthesis, is also possible.

You can start working in Micro-Cap even without deep mastery of the program. It is enough to familiarize yourself with the built-in demo video and look at the basic examples (there are about 300 of them in the kit). Experienced users, using an extensive library of components and proprietary macro models, can analyze complex electronic systems. Proper use of simplified assumptions allows one to carry out calculations of the operating modes of complex devices with sufficient high degree accuracy.

Micro-Cap 9, 10 differ from the younger representatives of their family in more advanced models of electronic components and calculation algorithms. In terms of circuit modeling capabilities, it is on a par with the integrated packages ORCAD and PCAD2002 - rather complex tools for analyzing and designing electronic devices, implying primarily professional use. Full compatibility with SPICE models and SPICE circuits, combined with advanced conversion capabilities, allows you to use in Micro-Cap all developments and models intended for these packages, and the acquired modeling skills will allow you to quickly master professional modeling packages if necessary.

Micro-Cap 9, 10 provide extensive capabilities for analyzing power converter devices. The program has settings, the inclusion of which optimizes algorithms for calculating power circuits; the library of components contains a large number of generalized PWM controllers and continuous models of the main types of voltage converters for analyzing the stability of stabilized power supplies based on them.

The listed advantages make the Micro-Cap program very attractive for modeling electronic devices of medium complexity. Ease of use, low demands on computer resources and the ability to analyze electronic devices with sufficient big amount components allow it to be successfully used by both radio amateurs and students, as well as development engineers. In addition, Micro-Cap family programs are actively used in research activities.

The first versions of Micro-Cap, indeed, were quite primitive and unsuitable for solving real engineering problems of circuit design. They made it possible to calculate only simple analog circuits. To calculate digital devices, another program from the same company was used - MicroLogic (later it was integrated into Micro-Cap). But even this was quite enough to teach students the basics of electronics.

I would especially like to note the program interface. The developers take this issue very seriously, starting with the younger versions. Suffice it to say that even before the widespread distribution of Windows, the version of Micro-Cap IV, released in 1992, already had a very convenient windowed graphical interface, which was not at all typical for programs of that time. This interface allowed DOS to obtain almost all the conveniences that Windows users currently have.

Using the Micro-Cap program allows you not only to study the operation of electronic circuits, but also to acquire skills in setting up electronic devices. The basic methods for obtaining a working model are no different from the methods for introducing real electronic devices into operating mode. It is these properties that make it possible to recommend it primarily to students and radio amateurs.

automated program radio-electronic frequency

2. Circuit modeling of RES

2.1 Description of the process of preparing RES for modeling

The electrical circuit diagram of the simulated RES is shown in the figure.

This RES is a selective amplifier (audio frequency amplifier). The simulation was carried out in Micro-Cap 9, a SPICE-like program for analog and digital simulation of electrical and electronic circuits with an integrated visual editor.

To model the RES, I did the following:

1) A sinusoidal voltage generator with a voltage amplitude of 0.5 V and an oscillation frequency of 5 kHz was used as an input signal source;

2) The terminal device was represented by a load resistor of 4 Ohms, which is equivalent to the size of the terminal devices of similar amplifiers, such as a speaker speaker;

3) The K140UD8 operational amplifier was not in the Micro-Cap program library. An analogue of this amplifier will be considered the MC1558 operational amplifier, which is closest in its parameters to the K140UD8;

4) Analogues were selected for transistors KT310V, KT3107V, KT815V, KT814V. A pair of complementary transistors KT310V - KT3107V was replaced by a pair of complementary transistors bc107BP - bc178AP.

In the process of analyzing the circuit, it was found that in this RES the input signal is amplified due to its passage through an op-amp connected via an inverting amplifier circuit. The final stage consists of a voltage divider and two pairs of complementary transistors connected in a circuit with a common collector. The need to introduce pairs of complementary transistors is due to the inadmissibility of distortion of the input signal, so we need to obtain the same gain for both the positive and negative half-waves of the input signal. Connecting according to a circuit with a common collector allows you to obtain a gain in current, and therefore in power.

2.2 Simulation of static characteristics

The static characteristics of the RES are shown in the figure.

The graph shows that the input signal is amplified in the negative region. This is explained by the fact that an op-amp connection is used in an inverting amplifier circuit.

2.2 Simulation of dynamic characteristics

The dynamic characteristics of the RES are shown in the figure.

The graph shows that there is a slight distortion of the input signal. The phase of the signal did not change to the opposite, since an op-amp connection was used according to a non-inverting amplifier circuit. The output signal is a scaled copy of the input signal.

Based on the above, we can conclude that the amplifier circuit performs its function by amplifying the input signal and without introducing distortion into it.

2.3 Modeling frequency characteristics

The frequency response of the amplifier is shown in the figure.

From the frequency characteristics of the first stage it is clear that the op-amp provides signal amplification at frequencies from 5 Hz. We can conclude that the frequency band passed by the amplifier is approximately equal to that of a typical audio frequency amplifier and lies in the range from 1 kHz to 30 kHz. Since the op-amp connection was used according to the inverting amplifier circuit, we see a change in the phase of the signal to the opposite one.

Conclusion

Based on the results of the test, the following results were achieved:

Mastered methods of computer-aided design and circuit modeling of RES nodes and blocks using CAD tools.

The capabilities of modern CAD RES application software packages have been studied;

Formation of theoretical knowledge and practical skills in using CAD tools in circuit modeling of components and blocks of electronic distribution systems.

The main capabilities of the circuit modeling package used in the test work are analyzed;

Simulation of static, dynamic and frequency characteristics of RES nodes and blocks was carried out;

The parameters and characteristics of the RES were optimized.

Having achieved the initially set objectives, I consider the test work completed, and the studied RES is suitable for use in practical activities.

Bibliography

1. Razevig V.D. Circuit modeling using Micro-CAP 7. - M.: Hotline-Telecom, 2003. - 368 p., ill.

2. Razevig V.D. End-to-end design system for electronic devices Design Lab 8.0. - Moscow, “Solon”, 2003.

3. Amelina M.A., Amelin S.A. Circuit modeling program Micro-Cap 8. - M.: Hot Line-Telecom, 2007. - 464 p. ill.

4. Gorbatenko S.A., Gorbatenko V.V., Sereda E.N. Fundamentals of computer design and modeling of radio-electronic equipment: guidelines for course design. Voronezh: Voronezh Institute of the Ministry of Internal Affairs of Russia, 2012. ? 27 p.

5. Automation of the design of radio-electronic equipment: Textbook. manual for universities / O.V. Alekseev, A.A. Golovkov, I.Yu. Pivovarov and others; Ed. O.V. Alekseeva. - Recommendation Ministry of Defense of the Russian Federation. - M.: Higher school, 2000. - 479 p.

6. Antipensky R.V. Circuit design and modeling of radio-electronic devices / R.V. Antipensky, A.G. Fadin. - M.: Tekhnosphere, 2007. - 127 p.

7. Kardashev G.A. Digital electronics on personal computer/ G.A. Kardashev. - M.: Hotline - Telecom, 2003. - 311 p.

8. Petrakov O.M. Creation of analog PSPICE models of radio elements / O.M. Petrakov. - M.: RadioSoft, 2004. - 205 p.

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Modeling of elements and nodes of res. Modeling of elements and assemblies of electronic distribution systems: Program of the academic discipline and guidelines for completing the test

Chapter 1. Basic concepts, definitions, classification 9

Chapter 2. Classification of modeling methods 37

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