Field effect transistors 6 amperes 600 volts. MOSFET Field Effect Transistor

Technological capabilities and advances in the development of high-power field-effect transistors have led to the fact that nowadays it is not difficult to purchase them at an affordable price.

In this regard, the interest of radio amateurs in the use of such MOSFET transistors in their electronic homemade products and projects has increased.

It is worth noting the fact that MOSFETs differ significantly from their bipolar counterparts, both in parameters and in their design.

It's time to become more familiar with the design and parameters of powerful MOSFET transistors, so that, if necessary, you can more consciously select an analogue for a specific instance, and also be able to understand the essence of certain quantities indicated in the datasheet.

What is a HEXFET transistor?

In the family of field-effect transistors there is a separate group of powerful semiconductor devices called HEXFET. Their operating principle is based on a very original technical solution. Their structure consists of several thousand MOS cells connected in parallel.

The cellular structures form a hexagon. Due to the hexagonal or otherwise hexagonal structure this type power MOSFETs are called HEXFETs. The first three letters of this abbreviation are taken from the English word hex agonal– “hexagonal”.

Under multiple magnification, the crystal of a powerful HEXFET transistor looks like this.

As you can see, it has a hexagonal structure.

It turns out that a powerful MOSFET is essentially a kind of super-microcircuit that combines thousands of individual simple field-effect transistors. Together, they create one powerful transistor that can pass a large current through itself and at the same time provide virtually no significant resistance.

Thanks to the special structure and manufacturing technology of HEXFET, the resistance of their channel RDS(on) managed to significantly reduce. This made it possible to solve the problem of switching currents of several tens of amperes at voltages of up to 1000 volts.

Here is just a small area of ​​application of high-power HEXFET transistors:

    Power supply switching circuits.

    Charging device.

    Electric motor control systems.

    Low frequency amplifiers.

Despite the fact that mosfets made using HEXFET technology (parallel channels) have a relatively low open-channel resistance, their scope is limited, and they are used mainly in high-frequency, high-current circuits. In high-voltage power electronics, IGBT-based circuits are sometimes preferred.


Image of a MOSFET transistor on the circuit board electrical diagram(N-channel MOS).

Like bipolar transistors, field structures can be forward or reverse conduction. That is, with a P-channel or N-channel. The conclusions are indicated as follows:

    D-drain (drain);

    S-source (source);

    G-gate (shutter).

About how field-effect transistors are designated different types Schematic diagrams can be found on this page.

Basic parameters of field-effect transistors.

The entire set of MOSFET parameters may be required only by developers of complex electronic equipment and, as a rule, are not indicated in the datasheet (reference sheet). It is enough to know the basic parameters:

    V DSS(Drain-to-Source Voltage) – voltage between drain and source. This is typically the supply voltage for your circuit. When selecting a transistor, you must always remember the 20% margin.

    I D(Continuous Drain Current) – drain current or continuous drain current. Always indicated at a constant gate-source voltage (for example, V GS =10V). The datasheet usually indicates the maximum possible current.

    RDS(on)(Static Drain-to-Source On-Resistance) – drain-to-source resistance of the open channel. As the crystal temperature increases, the open channel resistance increases. This is easy to see in the graph taken from the datasheet of one of the high-power HEXFET transistors. The lower the on-channel resistance (R DS(on)), the better the mosfet. It heats up less.

    P D(Power Dissipation) – transistor power in watts. In another way, this parameter is also called dissipation power. In the datasheet for a specific product, the value this parameter indicated for a specific crystal temperature.

    VGS(Gate-to-Source Voltage) – gate-to-source saturation voltage. This is the voltage above which the current through the channel does not increase. Essentially, this is the maximum voltage between gate and source.

    V GS(th)(Gate Threshold Voltage) – threshold voltage for turning on the transistor. This is the voltage at which the conductive channel opens and it begins to pass current between the source and drain terminals. If a voltage less than V GS(th) is applied between the gate and source terminals, the transistor will be turned off.

The graph shows how the threshold voltage V GS(th) decreases with increasing temperature of the transistor crystal. At a temperature of 175 0 C it is about 1 volt, and at a temperature of 0 0 C it is about 2.4 volts. Therefore, the datasheet usually indicates the minimum ( min.) and maximum ( max.) threshold voltage.

Let's consider the main parameters of a powerful HEXFET field-effect transistor using the example IRLZ44ZS from International Rectifier. Despite its impressive performance, it has a compact body D 2 PAK for surface mounting. Let's look at the datasheet and evaluate the parameters of this product.

    Drain-source voltage limit (V DSS): 55 Volts.

    Maximum drain current (I D): 51 Ampere.

    Gate-source voltage limit (V GS): 16 Volts.

    Open channel drain-source resistance (R DS(on)): 13.5 mOhm.

    Maximum power (P D): 80 Watt.

The IRLZ44ZS open channel resistance is only 13.5 milliohms (0.0135 ohms)!

Let's take a look at the “piece” from the table where the maximum parameters are indicated.

It is clearly visible how, at a constant gate voltage, but with increasing temperature, the current decreases (from 51A (at t=25 0 C) to 36A (at t=100 0 C)). Power at a housing temperature of 25 0 C is equal to 80 Watts. Some parameters in pulse mode are also indicated.

MOSFET transistors have high speed, but they have one significant drawback - large gate capacitance. In the documents, the gate input capacitance is designated as C iss (Input Capacity).

What does gate capacitance affect? It greatly influences certain properties of field-effect transistors. Since the input capacitance is quite large and can reach tens of picofarads, the use of field-effect transistors in circuits high frequency limited.

Important features of MOSFET transistors.

It is very important when working with field-effect transistors, especially those with an insulated gate, to remember that they are “deadly” afraid of static electricity. You can solder them into the circuit only by first short-circuiting the leads together with a thin wire.

When storing, it is better to short-circuit all terminals of the MOS transistor using ordinary aluminum foil. This will reduce the risk of static electricity damaging the gate. When installing it on printed circuit board It is better to use a soldering station rather than a regular electric soldering iron.

The fact is that an ordinary electric soldering iron does not have protection against static electricity and is not “isolated” from the mains through a transformer. Its copper tip always contains electromagnetic interference from the electrical network.

Any voltage surge in the electrical network can damage the soldered element. Therefore, when soldering a field-effect transistor into a circuit with an electric soldering iron, we risk damaging the MOSFET transistor.

This material provides background information on foreign high-power field-effect transistors. The table shows only the main parameters - the maximum drain voltage, current, power dissipation and resistance of the open drain-source junction. For more detailed information, copy the name of the transistor into the DATASHEET field - at the top right of the page and download PDF file with description. Power field-effect transistors are often used in voltage and current stabilizers, output stages of power amplifiers, switches chargers and converters.

POWERFUL IMPORTED FIELD TRANSISTORS

Brand Voltage, V Transition resistance, Ohm Drain current, A Power, W Frame
1 2 3 4 5 6
STH60N0SFI 50 0,023 40,0 65 ISOWATT218
STVHD90FI 50 0,023 30,0 40 ISOWATT220
STVHD90 50 0,023 52,0 125 TO-220
STH60N05 50 0,023 60,0 150 TO-218
IRFZ40 50 0,028 35.0 125 TO-220
BUZ15 50 0.03 45,0 125 TO-3
SGSP592 50 0,033 40,0 150 TO-3
SGSP492 50 0.033 40,0 150 TO-218
IRFZ42FI 50 0,035 24,0 40 ISOWATT220
IRFZ42 50 0,035 35,0 125 TO-220
BUZ11FI 50 0,04 20,0 35 ISOWATT220
BUZ11 50 0,04 30,0 75 TO-220
BUZ14 50 0,04 39,0 125 TO-3
BUZ11A 50 0,06 25,0 75 TO-220
SGSP382 50 0.06 28,0 100 TO-220
SGSP482 50 0.06 30.0 125 TO-218
BUZ10 50 0.08 20.0 70 TO-220
BUZ71FI 50 0,10 12,0 30 ISOWATT220
IRF20FI 50 0,10 12,5 30 ISOWATT220
BUZ71 50 6,10 14,0 40 TO-220
IRFZ20 50 0,10 15.0 40 TO-220
BUZ71AFI 50 0,12 11,0 30 ISOWATT220
IRFZ22FI 50 0,12 12,0 30 ISOWATT220
BUZ71A 50 0,12 13,0 40 TO-220
IRFZ22 50 0,12 14,0 40 TO-220
BUZ10A 50 0,12 17,0 75 TO-220
SGSP322 50 0,13 16,0 75 TO-220
SGSP358 50 0.30 7,0 50 TO-220
MTH40N06FI 60 0,028 26,0 65 ISOWATT218
MTH40N06 60 0,028 40,0 150 TO-218
SGSP591 60 0,033 40,0 150 TO-3
SGSP491 60 0,033 40,0 150 TO-218
BUZ11S2FI 60 0,04 20,0 35 ISOWATT220
BUZ11S2 60 0,04 30,0 75 TO-220
IRFP151FI 60 0,055 26,0 65 ISOWATT218
IRF151 60 0.055 40,0 150 TO-3
IRFP151 60 0.055 40,0 150 TO-218
SGSP381 60 0,06 28,0 100 TO-220
SGSP481 60 0.06 30.0 125 TO-218
IRFP153FI 60 0,08 21,0 65 ISOWATT218
IRF153 60 0,08 33,0 150 TO-3
IRFP153 60 0,08 34.0 150 TO-218
SGSP321 60 0,13 16,0 75 TO-220
MTP3055EFI 60 0,15 10,0 30 ISOWATT220
MTP3055E 60 0,15 12.0 40 TO-220
IRF521FI 80 0,27 7,0 30 ISOWATT220
IRF521 80 0.27 9,2 60 TO-220
IRF523FI 80 036 6,0 30 ISOWATT220
IRF523 80 0.36 8,0 60 TO-220
SGSP472 80 0,05 35.0 150 TO-218
IRF541 80 0,077 15,0 40 ISOWATT220
IRF141 80 0.077 28,0 125 TO-3
IRF541 80 0.077 28,0 125 TO-220
IRF543F1 80 0,10 14,0 40 SOWATT220
SGSP362 80 0,10 22.0 100 TO-220
IRF143 80 0,10 25,0 125 TO-3
SGSP462 80 0.10 25,0 125 TO-218
IRF543 80 0,10 25.0 125 O-220
IRF531FI 80 0.16 9,0 35 SOWATT220
IRF531 80 0.16 14,0 79 O-220
IRF533FI 80 0,23 8,0 35 ISOWATT220
IRF533 80 0,23 12.0 79 TO-220
IRF511 80 0,54 5.6 43 TO-220
IRF513 80 0,74 4,9 43 TO-220
IRFP150FI 100 0,055 26,0 65 ISOWATT218
IRF150 100 0,055 40,0 150 TO-3
IRFP150 100 0,055 40,0 150 TO-218
BUZ24 100 0,6 32,0 125 TO-3
IRF540FI 100 0,077 15,0 40 ISOWATT220
IRF140 100 0,077 28,0 125 TO-3
IRF540 100 0,077 28,0 125 TO-220
SGSP471 100 0,075 30,0 150 TO-218
IRFP152FI 100 0,08 21,0 65 ISOWATT218
IRF152 100 0,08 33,0 150 TO-3
IRFP152 100 0,08 34.0 150 TO-218
IRF542FI 100 0,10 14,0 40 ISOWATT220
BUZ21 100 0,10 19.0 75 TO-220
BUZ25 100 0,10 19.0 78 TO-3
IRF142 100 0,10 25,0 125 TO-3
IRF542 100" 0,10 25,0 125 TO-220
SGSP361 100 0,15 18,0 100 TO-220
SGSP461 100 0,15 20.0 125 TO-218
IRF530FI 100 0,16 9,0 35 ISOWATT220
IRF530 100 0,16 14.0 79 TO-220
BUZ20 100 0,20 12.0 75 TO-220
IRF532FI 100 0.23 8.0 35 ISOWATT220
IRF532 100 0,23 12,0 79 TO-220
BUZ72A 100 0,25 9,0 40 TO-220
IRF520FI 100 0.27 7,0 30 ISOWATT220
IRF520 100 0,27 9,2 60 TO-220
SGSP311 100 0,30 11.0 75 TO-220
IRF522FI 100 0,36 6.0 30 ISOWATT220
IRF522 100 0,36 8,0 60 TO-220
IRF510 100 0,54 5,6 43 TO-220
SGSP351 100 0,60 6,0 50 TO-220
IRF512 100 0,74 4,9 43 TO-220
SGSP301 100 1,40 2,5 18 TO-220
IRF621FI 160 0,80 4.0 30 ISOWATT220
IRF621 150 0,80 5,0 40 TO-220
IRF623FI 150 1,20 3,5 30 ISOWATT220
IRF623 150 1.20 4.0 40 TO-220
STH33N20FI 200 0.085 20.0 70 ISOWATT220
SGSP577 200 0,17 20,0 150 TO-3
SGSP477 200 0,17 20,0 150 TO-218
8UZ34 200 0,20 19,0 150 TO-3
SGSP367 200 0,33 12,0 100 TO-220
BUZ32 200 0,40 9,5 75 TO-220
SGSP317 200 0,75 6,0 75 TO-220
IRF620FI 200 0,80 4,0 30 ISOWATT220
IRF620 200 0,80 5,0 40 TO220
IRF622FI 200 1.20 3,5 30 ISOWATT220
IRF622 200 1.20 4,0 40 TO-220
IRF741FI 350 0.55 5,5 40 ISOWATT220
IRF741 350 0,55 10,0 125 TO-220
IRF743 350 0.80 8,3 125 TO-220
IRF731FI 350 1,00 3,5 35 ISOWATT220
IRF731 350 1,00 5,5 75 TO-220
IRF733FI 350 1,50 3,0 35 ISOWATT220
IRF733 350 1,50 4.5 75 TO-220
IRF721FI 350 1,80 2.5 30 ISOWATT220
IRF721 350 1,80 3.3 50 TO-220
IRF723FI 350 2,50 2,0 30 ISOWATT220
IRF723 350 2,50 2,8 50 TO-220
IRFP350FI 400 0,30 10,0 70 ISOWATT218
IRF350 400 0,30 15,0 150 TO-3
IRFP350 400 0,30 16,0 180 TO-218
IRF740FI 400 0,55 5,5 40 ISOWATT220
IRF740 400 0,55 10,0 125 TO-220
SGSP475 400 0,55 10,0 150 TO-218
IRF742FI 400 0,80 4,5 40 ISOWATT220
IRF742 400 0,80 8,3 125 TO-220
IRF730FI 400 1,00 3,5 35 ISOWATT220
BUZ60 400 1,00 5,5 75 TO-220
IRF730 400 1,00 5,5 75 TO-220
IRF732FI 400 1,50 3,0 35 ISOWATT220
BUZ60B 400 1,50 4,5 75 TO-220
IRF732 400 1,50 4,5 75 TO-220
IRF720FI 400 1,80 2,5 30 ISOWATT220
BUZ76 400 1,80 3,0 40 TO-220
IRF720 400 1,80 3,3 50 TO-220
IRF722FI 400 2,50 2,0 30 ISOWATT220
BUZ76A 400 2,50 2,6 40 TO-220
IRF722 400 2,50 2,8 50 TO-220
SGSP341 400 20,0 0,6 18 TO-220
IRFP451FI 450 0,40 9,0 70 ISOWATT218
IRF451 450 0,40 13,0 150 TO-3
IRFP451 450 0,40 14,0 180 TO-218
IRFP453FI 450 0,50 8,0 70 ISOWATT218
IRF453 450 0,50 11,0 150 TO-3
IRFP453 450 0,50 12,0 180 TO-218
SGSP474 450 0,70 9,0 150 TO-218
IRF841FI 450 0,85 4,5 40 ISOWATT220
IF841 450 0.85 8,0 125 TO-220
IRFP441FI 450 0,85 5,5 60 ISOWATT218
IRF843FI 450 1,10 4,0 40 ISOWATT220
IRF843 450 1,10 7,0 125 TO-220
IRF831FI 450 1,50 3,0 35 ISOWATT220
IRF831 450 1,50 4,5 75 TO-220
SGSP364 450 1,50 5,0 100 TO-220
IRF833FI 450 2,00 2,5 35 ISOWATT220
IRF833 450 2,00 4,0 75 T0220
IRF821FI 450 3,00 2,0 30 ISOWATT220
IRF821 450 3,00 2,5 50 TO-220
SGSP330 450 3,00 3,0 75 TO-220
IRF823FI 450 4,00 1.5 30 ISOWATT220
IRF823 450 4,00 2,2 50 TO-220
IRFP450FI 500 0,40 9,0 70 ISOWATT218
IRF450 500 0,40 13,0 150 TO-3
IRFP450 500 0,40 14,0 180 TO-218
IRFP452FI 500 0,50 8,0 70 ISOWATT218
IRF452 500 0,50 11,0 150 TO-3
IRFP4S2 500 0,50 12,0 180 TO-218
BUZ353 500 0,60 9,5 125 TO-218
BUZ45 500 0,60 9,6 125 TO-3
SGSP579 500 0,70 9,0 150 TO-3
SGSP479 500 0,70 9.0 150 TO-218
BU2354 500 0,80 8,0 125 TO-218
BUZ45A 500 0,80 8,3 125 TO-3
IRF840FI 500 0,85 4,5 40 ISOWATT220
IRF840 500 0,85 8,0 125 TO-220
IRFP440FI 500 0,85 5,5 60 ISOWATT218
IRF842FI 500 1,10 4,0 40 ISOWATT220
IRF842 500 1.10 7,0 125 TO-220
IRF830FI 500 1,50 3,0 35 ISOWATT220
BUZ41A 500 1,50 4,5 75 TO-220
IRF830 500 1,50 4,5 75 TO-220
SGSP369 500 1,50 5,0 100 TO-220
IRF832FI 500 2,00 2,5 35 ISOWATT220
BUZ42 500 2,00 4,0 75 TO-220
IRF832 500 2,00 4,0 75 TO-220
IRF820FI 500 3,00 2,0 30 ISOWATT220
BUZ74 500 3,00 2,4 40 TO-220
IRF820 500 3,00 2,5 50 TO-220
SGSP319 500 3,80 2,8 75 TO-220
IRF322FI 500 4,00 1,5 30 ISOWATT220
BUZ74A 500 4,00 2,0 40 TO-220
IRF822 500 4,00 2,2 50 TO-220
SGSP368 550 2,50 5,0 100 TO-220
MTH6N60FI 600 1,20 3.5 40 ISOWATT218
MTP6N60FI 600 1,20 6,0 125 ISOWATT220
MTP3N60FI 600 .2,50 2,5 35 I30WATT220
MTP3N60 600 2,50 3,0 75 TO-220
STH9N80FI 800 1,00 . 5,6 70 ISOWATT218
STH9N80 800 1,00 9,0 180 TO-218
STH8N80FI 800 1,20 5,0 70 ISOWATT218
STH8N80 800 1,20 8.0 180 TO-218
STHV82FI 800 2,00 3,5 65 ISOWATT218
STHV82 800 2,00 5,5 125 TO-218
BUZ80AFI 800 3,00 2,4 40 ISOWATT220
BUZ80A 800 3,00 3,8 100 TO-220
BUZ80FI 800 4,00 2,0 35 ISOWATT220
BUZ80 800 4,00 2,6 75 TO-220
STH6N100FI 1000 2,00 3,7 70 ISOWATT218
STH6N100 1000 2,00 6,0 180 TO-218
STHV102FI 1000 3,50 3,0 65 ISOWATT218
STHV102 1000 3,50 4,2 125 TO-218
SGS100MA010D1 100 0,014 50 120 TO-240
SGS150MA010D1 100 0,009 75 150 TO-240
SGS30MA050D1 500 0,20 15 30 TO-240
SGS35MA050D1 500 0,16 17,5 35 TO-240
TSD200N05V 50 0,006 200 600 Isotop
TSD4M150V 100 0,014 70 135 Isotop
TSD4M251V 150 0,021 70 110 Isotop
TSD4M250V 200 0,021 60 110 Isotop
TSD4M351V 350 0,075 30 50 Isotop
TSD4M350V 400 0,075 30 50 Isotop
TSD4M451V 450 0,1 28 45 Isotop
TSD2M450V 500 0,2 26 100 Isotop
TSD4M450V 500 0,1 28 45 Isotop
TSD22N80V 800 0,4 22 77 Isotop
TSD5MG40V 1000 0,7 9 17 Isotop

The field effect transistor can be checked for serviceability with a multimeter in the mode P-N testing diode transitions. The resistance value shown by the multimeter at this limit is numerically equal to the forward voltage at P-N junction in millivolts. A working transistor should have infinite resistance between all its terminals. But some modern high-power field-effect transistors have a built-in diode between the drain and source, so it happens that the drain-source channel behaves like a regular diode when tested. Use the black (negative) probe to touch the drain (D), and the red (positive) probe touch the source (S). The multimeter shows the forward voltage drop across the internal diode (500 - 800 mV). In reverse bias, the multimeter should show infinite resistance, the transistor is closed. Next, without removing the black probe, touch the red probe to the gate (G) and again return it to the source (S). The multimeter shows 0 mV, and with any polarity of the applied voltage, the field-effect transistor opened by touch. If you now touch the gate (G) with the black probe, without releasing the red probe, and return it to the drain (D), the field-effect transistor will close and the multimeter will again show the voltage drop across the diode. This is true for most N-channel FETs.

In technology and amateur radio practice, field-effect transistors are often used. Such devices differ from conventional bipolar transistors in that in them the output signal is controlled by a control electric field. Insulated gate field effect transistors are especially often used.

The English designation for such transistors is MOSFET, which means “field-controlled metal-oxide semiconductor transistor.” In the domestic literature, these devices are often called MOS or MOS transistors. Depending on the manufacturing technology, such transistors can be n- or p-channel.

An n-channel type transistor consists of a silicon substrate with p-conductivity, n-regions obtained by adding impurities to the substrate, and a dielectric that insulates the gate from the channel located between the n-regions. The pins (source and drain) are connected to the n-regions. Under the influence of a power source, current can flow from source to drain through the transistor. The magnitude of this current is controlled by the insulated gate of the device.

When working with field-effect transistors, it is necessary to take into account their sensitivity to the effects of an electric field. Therefore, they must be stored with the terminals short-circuited with foil, and before soldering, the terminals must be short-circuited with a wire. Field-effect transistors must be soldered using a soldering station, which provides protection against static electricity.

Before you start checking the serviceability of the field-effect transistor, you need to determine its pinout. Often, on an imported device, marks are applied that identify the corresponding terminals of the transistor. The letter G denotes the gate of the device, the letter S the source, and the letter D the drain.
If there is no pinout on the device, you must look it up in the documentation for this device.

Circuit for checking an n-channel field-effect transistor with a multimeter

Before checking the serviceability of the field-effect transistor, it is necessary to take into account that in modern MOSFET-type radio components there is an additional diode between the drain and the source. This element is usually present on the device diagram. Its polarity depends on the type of transistor.

General rules that is, they say to begin the procedure by determining the performance of the measuring device itself. Having made sure that it works flawlessly, they move on to further measurements.

Conclusions:

  1. MOSFET field-effect transistors are widely used in technology and amateur radio practice.
  2. The performance of such transistors can be checked using a multimeter, following a certain method.
  3. Testing a p-channel field-effect transistor with a multimeter is carried out in the same way as an n-channel transistor, except that the polarity of the multimeter leads should be reversed.

Video on how to test a field-effect transistor

A transistor is a semiconductor electronic component. We refer it to active elements circuits because it allows electrical signals to be converted (nonlinearly).

Field or MOSFET(Metal-Oxide Semiconductor Field-Effect Transistor) - field-effect transistor with a metal-oxide-semiconductor structure. Therefore, it is often also called simply a MOS transistor.

Transistors produced using this technology consist of three layers:

  • The first layer is a wafer cut from a homogeneous silicon crystal or from silicon doped with germanium.
  • The second layer in order is the spraying of a very thin layer of dielectric (insulator) made of silicon dioxide or metal oxide (aluminum or zirconium oxides). The thickness of this layer is, depending on the technology, about 10 nm, and in the best option the thickness of this layer can be about 1.2 nm. For comparison: 5 silicon atoms located close to each other make up a thickness close to 1.2 nm.
  • The third layer is a layer consisting of a highly conductive metal. Gold is most often used for this purpose.

The design of such a transistor is shown schematically below:

It should be noted that field effect transistors come in two types: N-type and P-type, much the same as is the case with bipolar transistors, which are produced in PNP and NPN variants.

Among field-effect transistors, N-type is much more common. In addition, there are field-effect transistors:

  • with a depletion channel, that is, those that pass a weak current through themselves in the absence of voltage on the gate, and in order to completely block it, it is necessary to apply a reverse bias of a couple of volts to the gate;
  • with an enriched channel - this is a type of field-effect transistor that, in the absence of voltage at the gate, does not conduct current, but conducts it only when the voltage applied to the gate exceeds the source voltage.

The big advantage of FETs is that they are voltage controlled, unlike bipolar transistors, which are current controlled.

It is easier to understand the principle of their operation of a field-effect transistor using the example of a hydraulic crane.

To control the flow of high pressure fluid in a large pipe, little effort is required to open or close the valve. In other words, with a small amount of work, we get a big effect. The small force we apply to the faucet handle controls a much greater force of water, which presses on the valve.

Thanks to this property of field-effect transistors, we can control currents and voltages that are much higher than those that are given to us, for example, by a microcontroller.

As noted earlier, a conventional MOSFET, as a rule, does not conduct current in the source-drain path. To transfer such a transistor to the conductive state, it is necessary to apply a voltage between the source and the gate as shown in the figure below.

The following figure shows the current-voltage characteristic of the IRF540 transistor.

The graph shows that the transistor begins to conduct when the voltage between the gate and source approaches 4V. However, almost 7 volts are needed to fully open. This is much more than the microcontroller can output.

In some cases, a current of 15 mA and a voltage of 5V may be sufficient. But what if it's too little? There are two ways out.

  1. You can use special MOSFETs with reduced gate-source voltage, for example, BUZ10L.
  2. Alternatively, you can use an additional amplifier to increase the control voltage.

Regardless of the scope of application, each field-effect transistor has several key parameters, namely:

  • Allowable drain-source voltage: UDSmax
  • Maximum drain current: IDmax
  • Opening threshold voltage: UGSth
  • On-state channel resistance: RDSon

In many cases, RDSon is a key parameter, since it indirectly indicates to us a loss of power, which is extremely undesirable.

For example, let’s take a transistor in a TO-220 package with a resistance of RDSon = 0.05 Ohm and a current of 4A flowing through this transistor.

Let's calculate the power losses:

  • UDS=0.05Ohm x 4A=0.2V
  • P=0.2V x 4A=0.8W

The power loss that a transistor in a TO-220 package can dissipate is just over 1 W, so in this case you can do without a radiator. However, already for a current of 10A the losses will be 5W, so there is no way to do without a radiator.

Therefore, the smaller the RDSon, the better. Therefore, when selecting a MOSFET transistor for a specific application, this parameter should always be taken into account.

In practice, with increasing permissible voltage UDSmax increases source-drain resistance. For this reason, transistors with a UDSmax greater than that required should not be selected.

MOP (in bourgeois MOSFET) stands for Metal-Oxide-Semiconductor, from this abbreviation the structure of this transistor becomes clear.

If on the fingers, then it has a semiconductor channel that serves as one plate of the capacitor and the second plate is a metal electrode located through a thin layer of silicon oxide, which is a dielectric. When voltage is applied to the gate, this capacitor is charged, and the electric field of the gate pulls charges to the channel, as a result of which mobile charges appear in the channel that can form an electric current and the drain-source resistance drops sharply. The higher the voltage, the more charges and lower the resistance, as a result, the resistance can drop to tiny values ​​- hundredths of an ohm, and if you raise the voltage further, a breakdown of the oxide layer and the Khan transistor will occur.

The advantage of such a transistor, compared to a bipolar one, is obvious - voltage must be applied to the gate, but since it is a dielectric, the current will be zero, which means the required the power to control this transistor will be scanty, in fact, it only consumes at the moment of switching, when the capacitor is charging and discharging.

The disadvantage arises from its capacitive property - the presence of capacitance on the gate requires a large charging current when opening. In theory, equal to infinity on infinitely small periods of time. And if the current is limited by a resistor, then the capacitor will charge slowly - there is no escape from the time constant of the RC circuit.

MOS transistors are P and N duct. They have the same principle, the only difference is the polarity of the current carriers in the channel. Accordingly, in different directions of the control voltage and inclusion in the circuit. Very often transistors are made in the form of complementary pairs. That is, there are two models with exactly the same characteristics, but one of them is N channel, and the other is P channel. Their markings, as a rule, differ by one digit.


My most popular MOP transistors are IRF630(n channel) and IRF9630(p channel) at one time I made about a dozen of them of each type. Possessing a not very large body TO-92 this transistor can famously pull through itself up to 9A. Its open resistance is only 0.35 Ohm.
However, that's quite old transistor, now there are cooler things, for example IRF7314, capable of carrying the same 9A, but at the same time it fits into an SO8 case - the size of a notebook square.

One of the docking problems MOSFET transistor and microcontroller (or digital circuit) is that in order to fully open until completely saturated, this transistor needs to drive quite a bit more voltage onto the gate. Usually this is about 10 volts, and the MK can output a maximum of 5.
There are three options:


But in general, it is more correct to install a driver, because in addition to the main functions of generating control signals, it also provides current protection, protection against breakdown, overvoltage, as an additional bauble, optimizes the opening speed to the maximum, in general, it does not consume its current in vain.

Choosing a transistor is also not very difficult, especially if you don’t bother with limiting modes. First of all, you should be concerned about the value of the drain current - I Drain or I D you choose a transistor based on the maximum current for your load, preferably with a margin of 10 percent. The next important parameter for you is VGS- Source-Gate saturation voltage or, more simply, control voltage. Sometimes it is written, but more often you have to look at the charts. Looking for a graph of the output characteristic Dependency I D from VDS at different values VGS. And you figure out what kind of regime you will have.

For example, you need to power the engine at 12 volts, with a current of 8A. You screwed up the driver and only have a 5 volt control signal. The first thing that came to mind after this article was IRF630. The current is suitable with a margin of 9A versus the required 8. But let’s look at the output characteristic:

If you are going to use PWM on this switch, then you need to inquire about the opening and closing times of the transistor, choose the largest one and, relative to the time, calculate the maximum frequency of which it is capable. This quantity is called Switch Delay or t on,t off, in general, something like this. Well, the frequency is 1/t. It’s also a good idea to look at the gate capacity C iss Based on it, as well as the limiting resistor in the gate circuit, you can calculate the charging time constant of the RC gate circuit and estimate the performance. If the time constant is greater than the PWM period, then the transistor will not open/close, but will hang in some intermediate state, since the voltage at its gate will be integrated by this RC circuit into a constant voltage.

When handling these transistors, keep in mind the fact that They are not just afraid of static electricity, but VERY STRONG. It is more than possible to penetrate the shutter with a static charge. So how did I buy it? immediately into foil and don’t take it out until you seal it. First ground yourself to the battery and put on a foil hat :).